产品概览
文档与媒体
- 数据列表
- T13F256C3
产品详情
- I/O 数 :
- 195
- LAB/CLB 数 :
- -
- 供应商器件封装 :
- 256-FBGA（13x13）
- 安装类型 :
- 表面贴装型
- 封装/外壳 :
- 256-TFBGA
- 工作温度 :
- 0°C ~ 85°C（TJ）
- 总 RAM 位数 :
- 744489
- 栅极数 :
- -
- 电压 - 供电 :
- 1.15V ~ 1.25V
- 逻辑元件/单元数 :
- 12828
采购与库存
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