产品概览
文档与媒体
- 数据列表
- MC33PF8200DNES
产品详情
- 供应商器件封装 :
- 56-HVQFN(8x8)
- 安装类型 :
- 表面贴装,可润湿侧翼
- 封装/外壳 :
- 56-VFQFN 裸露焊盘
- 工作温度 :
- -40°C ~ 105°C(TA)
- 应用 :
- 基于高性能 i.MX 8,S32x 处理器
- 电压 - 供电 :
- 2.5V ~ 5.5V
- 电流 - 供电 :
- -
采购与库存
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