产品概览
文档与媒体
- 数据列表
- ERC55274R00FHEB500
产品详情
- 供应商器件封装 :
- 轴向
- 功率 (W) :
- 0.125W，1/8W
- 大小 / 尺寸 :
- 0.094" 直径 x 0.250" 长（2.39mm x 6.35mm）
- 容差 :
- ±1%
- 封装/外壳 :
- 轴向
- 工作温度 :
- -65°C ~ 175°C
- 成分 :
- 金属薄膜
- 故障率 :
- -
- 温度系数 :
- ±50ppm/°C
- 特性 :
- 防潮
- 电阻 :
- 274 Ohms
- 端子数 :
- 2
- 高度 - 安装（最大值） :
- -
采购与库存
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