产品概览
文档与媒体
产品详情
- I/O 数 :
- 28
- LAB/CLB 数 :
- 160
- 供应商器件封装 :
- 36-WLCSP（2.54x2.59）
- 安装类型 :
- 表面贴装型
- 封装/外壳 :
- 36-UFBGA，WLCSP
- 工作温度 :
- -40°C ~ 100°C（TJ）
- 总 RAM 位数 :
- 65536
- 栅极数 :
- -
- 电压 - 供电 :
- 1.14V ~ 1.26V
- 逻辑元件/单元数 :
- 1280
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