产品概览
文档与媒体
- 数据列表
- 1SG166HN3F43E3XG
产品详情
- I/O 数 :
- 688
- LAB/CLB 数 :
- 207500
- 供应商器件封装 :
- 1760-FBGA（42.5x42.5）
- 安装类型 :
- 表面贴装型
- 封装/外壳 :
- 1760-BBGA，FCBGA
- 工作温度 :
- 0°C ~ 100°C（TJ）
- 总 RAM 位数 :
- -
- 栅极数 :
- -
- 电压 - 供电 :
- 0.82V ~ 0.88V
- 逻辑元件/单元数 :
- 1660000
采购与库存
推荐产品
您可能在找
SFR16S0001073FA500
SFR16S0001100FA500
SFR16S0001101FA500
SFR16S0001102FA500
SFR16S0001103FA500
SFR16S0001132FA500
SFR16S0001133FA500
SFR16S0001153FA500
SFR16S0001180FA500
SFR16S0001182FA500
SFR16S0001183FA500
SFR16S0001201FA500
SFR16S0001202FA500
SFR16S0001203FR500
SFR16S0001211FA500
SFR16S0001212FA500
SFR16S0001213FA500
SFR16S0001240FA500
SFR16S0001241FA500
SFR16S0001242FA500
