产品概览
文档与媒体
- 数据列表
- EP3SE50F484C4G
产品详情
- I/O 数 :
- 296
- LAB/CLB 数 :
- 1900
- 供应商器件封装 :
- 484-FBGA（23x23）
- 安装类型 :
- 表面贴装型
- 封装/外壳 :
- 484-BBGA，FCBGA
- 工作温度 :
- 0°C ~ 85°C（TJ）
- 总 RAM 位数 :
- 5760000
- 栅极数 :
- -
- 电压 - 供电 :
- 0.86V ~ 1.15V
- 逻辑元件/单元数 :
- 47500
采购与库存
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