产品概览
文档与媒体
- 数据列表
- EP1S25F672C8
产品详情
- I/O 数 :
- 473
- LAB/CLB 数 :
- 2566
- 供应商器件封装 :
- 672-FBGA（27x27）
- 安装类型 :
- 表面贴装型
- 封装/外壳 :
- 672-BBGA
- 工作温度 :
- 0°C ~ 85°C（TJ）
- 总 RAM 位数 :
- 1944576
- 栅极数 :
- -
- 电压 - 供电 :
- 1.425V ~ 1.575V
- 逻辑元件/单元数 :
- 25660
采购与库存
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