产品概览
文档与媒体
- 数据列表
- 5CEFA9F31C8N
产品详情
- I/O 数 :
- 480
- LAB/CLB 数 :
- 113560
- 供应商器件封装 :
- 896-FBGA（31x31）
- 安装类型 :
- 表面贴装型
- 封装/外壳 :
- 896-BGA
- 工作温度 :
- 0°C ~ 85°C（TJ）
- 总 RAM 位数 :
- 14251008
- 栅极数 :
- -
- 电压 - 供电 :
- 1.07V ~ 1.13V
- 逻辑元件/单元数 :
- 301000
采购与库存
推荐产品
您可能在找
RK73H1HTTC9102F
RK73H1HTTC1370F
RK73H1HTTC57R6F
RK73H1HTTC73R2F
RK73H1HTTC28R7F
RK73H1HTTC12R4F
RK73H1HTTC18R7F
RK73H1HTTC16R2F
RK73H1HTTC12R7F
RK73H1HTTC16R5F
RK73H1HTTC9313F
RK73H1HTTC19R1F
RK73H1HTTC6490F
RK73H1HTTC13R7F
RK73H1HTTC3093F
RK73H1HTTC93R1F
RK73H1HTTC3160F
RK73H1HTTC2431F
RK73H1HTTC1051F
RK73H1HTTC3303F
