产品概览
文档与媒体
- 数据列表
- XC5VLX30-2FF676I
产品详情
- I/O 数 :
- 400
- LAB/CLB 数 :
- 2400
- 供应商器件封装 :
- 676-FCBGA(27x27)
- 安装类型 :
- 表面贴装型
- 封装/外壳 :
- 676-BBGA,FCBGA
- 工作温度 :
- -40°C ~ 100°C(TJ)
- 总 RAM 位数 :
- 1179648
- 栅极数 :
- -
- 电压 - 供电 :
- 0.95V ~ 1.05V
- 逻辑元件/单元数 :
- 30720
采购与库存
推荐产品
您可能在找
RK73H1HTTC39R2D
RK73H1HTTC18R2D
RK73H1HTTC14R3D
RK73H1HTTC1101D
RK73H1HTTC1100D
RK73H1HTTC8453D
RK73H1HTTC19R6D
RK73H1HTTC2211D
RK73H1HTTC2103D
RK73H1HTTC80R6D
RK73H1HTTC5233D
RK73H1HTTC66R5D
RK73H1HTTC3601D
RK73H1HTTC2052D
RK73H1HTTC1272D
RK73H1HTTC6491D
RK73H1HTTC6192D
RK73H1HTTC3481D
RK73H1HTTC12R1D
RK73H1HTTC1052D
