产品概览
文档与媒体
- 数据列表
- M2GL060T-FCSG325I
产品详情
- I/O 数 :
- 200
- LAB/CLB 数 :
- -
- 供应商器件封装 :
- 325-FCBGA(11x11)
- 安装类型 :
- 表面贴装型
- 封装/外壳 :
- 325-TFBGA,FCBGA
- 工作温度 :
- -40°C ~ 100°C(TJ)
- 总 RAM 位数 :
- 1869824
- 栅极数 :
- -
- 电压 - 供电 :
- 1.14V ~ 2.625V
- 逻辑元件/单元数 :
- 56520
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