产品概览
文档与媒体
- 数据列表
- XC6SLX25-3CSG324C
产品详情
- I/O 数 :
- 226
- LAB/CLB 数 :
- 1879
- 供应商器件封装 :
- 324-CSPBGA（15x15）
- 安装类型 :
- 表面贴装型
- 封装/外壳 :
- 324-LFBGA，CSPBGA
- 工作温度 :
- 0°C ~ 85°C（TJ）
- 总 RAM 位数 :
- 958464
- 栅极数 :
- -
- 电压 - 供电 :
- 1.14V ~ 1.26V
- 逻辑元件/单元数 :
- 24051
采购与库存
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