产品概览
文档与媒体
- 数据列表
- TSI574-10GILV
产品详情
- 供应商器件封装 :
- 399-TEPBGA（21x21）
- 安装类型 :
- 表面贴装型
- 封装/外壳 :
- 399-BGA 裸露焊盘
- 应用 :
- 无线基础架构
- 类型 :
- Serial RapidIO® 开关
采购与库存
推荐产品
您可能在找
M55342H11B49E9RWS
M55342H11B4B99RWS
M55342H11B4E75RWS
M55342H11B4E99RWS
M55342H11B50D0RWS
M55342H11B52E3PWS
M55342H11B52E3RWS
M55342H11B53E6RWS
M55342H11B5B62PWS
M55342H11B5B62RWS
M55342H11B5E11RWS
M55342H11B5E76RWS
M55342H11B5E90RWS
M55342H11B60E4RWS
M55342H11B64D9PWS
M55342H11B64D9RWS
M55342H11B681DRWS
M55342H11B68D1RWS
M55342H11B68E1PWS
M55342H11B68E1RWS
