产品概览
文档与媒体
产品详情
- 供应商器件封装 :
- 69-ODCSP（5.55x5.57）
- 像素大小 :
- 3µm x 3µm
- 封装/外壳 :
- 69-WFBGA，CSPBGA
- 工作温度 :
- -
- 有源像素阵列 :
- 1280H x 800V
- 每秒帧数 :
- 60
- 电压 - 供电 :
- -
- 类型 :
- CMOS
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