产品概览
文档与媒体
产品详情
- 供应商器件封装 :
- 63-ODCSP（6.29x5.69）
- 像素大小 :
- 1.1µm x 1.1µm
- 封装/外壳 :
- 63-WFBGA，CSPBGA
- 工作温度 :
- -
- 有源像素阵列 :
- 4208H x 3120V
- 每秒帧数 :
- 30
- 电压 - 供电 :
- -
- 类型 :
- CMOS
采购与库存
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